Vapor Chamber 2.0

Ushering in a Future-Proof Era of Cooling Innovation

WHY VAPOR CHAMBERS?

Modern CPUs generate highly concentrated hotspots that traditional copper bases cannot distribute evenly. A vapor chamber uses liquid phase-change technology to spread heat rapidly across its surface, ensuring every heat pipe is utilized more efficiently.

Heat is then transferred from the coldplate through the vapor chamber into the heatpipes and fin stacks, delivering faster, more uniform cooling for today's high-performance Intel and AMD processors.

Vapor Chamber vs Traditional Copper Base

Traditional Copper Base

Heat concentrated at center
Higher thermal resistance
Lower heat transfer efficiency
Localized hotspots
Slower transient cooling

Vapor Chamber

Even heat distribution
Lower thermal resistance
Superior heat transfer
Excellent temperature uniformity
Faster transient cooling

Thermal Resistance

Intel® Core™ Ultra 9 285K @300 W

*Tested on the Same Heatsink with Different Base Designs

Base Type	Thermal Resistance	Thermal Conductivity
Copper Base	0.238 °C/W	401W/(m·K)
Vapor Chamber Base	0.225 °C/W	20000 W/(m·K)

VC 1.0

VC 2.0

VC 2.0 increases the CPU contact area, enhances overall structural strength, improves surface flatness of the VC. An enhanced capillary structure increases heat dissipation efficiency, while an optimized copper pillar layout strengthens the internal structure and improves heat transfer. Compared to the first-generation, VC 2.0 delivers up to a 15% improvement in cooling performance.

VC 1.0

Thermal Conductivity

17,000W/(m·K)

CPU Contact Surface Area

961mm²

CPU Temperature @ 300 W
(Same Heatsink)

96.5°C

VC 2.0

Thermal Conductivity

20,000 WW/(m·K)

CPU Contact Surface Area

1,292mm²

CPU Temperature @ 300 W
(Same Heatsink)

94.2°C

Cooling Performance

	VC 1.0	VC 2.0
Dimensions	60 × 60 mm	61 × 60 mm
CPU Contact Area	31 × 31 mm	38 × 34 mm
Copper Thickness	1 mm	1.2 mm
CPU Temperature @ 300 W (Same Heatsink)	Copper mesh	Copper sintered sheet

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